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| Freescale Semiconductor Technical Data MPVZ5004G Rev 1, 01/2006 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated The MPVZ5004G series piezoresistive transducers are state-of-the-art monolithic silicon pressure sensors designed for the appliance, consumer, healthcare and industrial market. The analog output can be read directly into the A/ D input of Freescale microcontrollers. This transducer combines advanced micromachining techniques, thin-film metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. The axial port has been modified to accommodate industrial grade tubing. Features * * * * * 1.5% Maximum Error for 0 to 100 mm H2O over +10 to +60C with Auto Zero 2.5% Maximum Error for 100 to 400 mm H2O over +10 to +60C with Auto Zero 6.25% Maximum Error for 0 to 400 mm H2O over +10 to +60C without Auto Zero Temperature Compensated over +10 to +60C Available in Surface Mount (SMT) or Through-hole (DIP) Configurations MPVZ5004G SERIES INTEGRATED PRESSURE SENSOR 0 to 3.92 kPA (0 to 400 mm H2O) 1.0 to 4.9 V OUTPUT SMALL OUTLINE PACKAGE SURFACE MOUNT Application Examples * Washing Machine Water Level Measurement (Reference AN1950) * Ideally Suited for Microprocessor or Microcontroller-Based Systems * Appliance Liquid Level and Pressure Measurement * Respiratory Equipment ORDERING INFORMATION Device Type Surface Mount Through-Hole Surface Mount Surface Mount Through-Hole Case No. 1735-01 1560-02 482-01 482-01 482B-03 MPVZ Series Order No. MPVZ5004GW6U MPVZ5004GW7U MPVZ5004G6U MPVZ5004G6T1 MPVZ5004G7U Packing Options Rails Rails Rails Tape & Reel Rails Device Marking MZ5004GW MZ5004GW MZ5004G MZ5004G MZ5004G MPVZ5004GW6U CASE 1735-01 MPVZ5004G6U/T1 CASE 482-01 SMALL OUTLINE PACKAGE THROUGH-HOLE J MPVZ5004GW7U CASE 1560-02 MPVZ5004G7U CASE 482B-03 PIN NUMBERS(1) 1 2 3 4 N/C VS GND VOUT 5 6 7 8 N/C N/C N/C N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. (c) Freescale Semiconductor, Inc., 2006. All rights reserved. VS Sensing Element Thin Film Temperature Compensation and Calibration Circuitry Gain Stage #2 and Ground Reference Shift Circuitry VOUT GND Pins 1, 5, 6, 7, and 8 are NO CONNECTS for small outline package device. Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Rating Maximum Pressure (P1 > P2) Storage Temperature Operating Temperature Symbol PMAX TSTG TA Value 16 -30 to +100 0 to +85 Unit kPa C C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. Table 2. Operating Characteristics (VS = 5.0 VDC, TA = 25C unless otherwise noted, P1 > P2) Characteristic Pressure Range Supply Voltage(1) Supply Current Full Scale Span(2) @ VS = 5.0 Volts Offset(3) (4) Sensitivity Accuracy(4) (5) 0 to 100 mm H2O (10 to 60C) 100 to 400 mm H2O (10 to 60C) 0 to 400 mm H2O (10 to 60C) 1. Device is ratiometric within this specified excitation range. 2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated pressure. 3. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 4. Accuracy (error budget) consists of the following: * Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. * Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. * Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25C. * Offset Stability: Output deviation, after 1000 temperature cycles, -30 to 100C, and 1.5 million pressure cycles, with minimum rated pressure applied. * TcSpan: Output deviation over the temperature range of 10 to 60C, relative to 25C. * TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 10 to 60C, relative to 25C. * Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25C. 5. Auto Zero at Factory Installation: Due to the sensitivity of the MPVZ5004G, external mechanical stresses and mounting position can affect the zero pressure output reading. Autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature change of 5C between autozero and measurement. Symbol POP VS IS VFSS VOFF V/P -- -- -- Min 0 4.75 -- -- 0.75 -- -- -- -- Typ -- 5.0 -- 4.0 1.0 1.0 9.8 -- -- -- Max 3.92 400 5.25 10 -- 1.25 -- 1.5 2.5 6.25 Units kPa mm H2O VDC mAdc V V V/kPa mV/mm H2O %VFSS with auto zero %VFSS with auto zero %VFSS without auto zero MPVZ5004G 2 Sensors Freescale Semiconductor ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the Differential or Gauge configuration in the basic chip carrier (Case 482). A gel die coat isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPVZ5004G series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and Fluorosilicone Gel Die Coat P1 Wire Bond Thermoplastic Case Vs Lead Frame 1.0 F P2 Differential Sensing Element 0.01 F IPS GND 470 pF Vout OUTPUT Stainless Steel Cap qualification test for dry air, and other media, are available from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the MPVZ5004G to the A/D input of the microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 and Figure 5 shows the sensor output signal relative to pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 10C to 60C using the decoupling circuit shown in Figure 3 The output will saturate outside of the specified pressure range. Die +5 V Die Bond Figure 2. Cross-Sectional Diagram (Not to Scale) Figure 3. Recommended Power Supply Decoupling and Output Filtering. (For additional output filtering, please refer to Application Note AN1646.) 5.0 TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] 2.5% VFSS VS = 5.0 Vdc TEMP = 10 to 60C MAX 2.0 1.0 0 MIN 5.0 4.0 3.0 Output (V) TYPICAL Output (V) MAX 2.0 1.0 0 MIN TRANSFER FUNCTION: Vout = VS*[(0.2*P) + 0.2] 6.25% VFSS VS = 5.0 Vdc TEMP = 10 to 60C 4.0 3.0 TYPICAL 0 1.0 2.0 Differential Pressure (kPa) 3.0 4.0 0 1.0 2.0 Differential Pressure (kPa) 3.0 4.0 Figure 4. Output versus Pressure Differential at 6.25% VFSS (without auto zero, note 5 in Operating Characteristics) Figure 5. Output versus Pressure Differential at 2.5% VFSS (with auto zero, note 5 in Operating Characteristics) MPVZ5004G Sensors Freescale Semiconductor 3 PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE Freescale Semiconductor designates the two sides of the pressure sensor as the Pressure (P1) side and the Vacuum (P2) side. The Pressure (P1) side is the side containing a gel die coat which isolates the die from the environment. The Part Number MPVZ5004GW6U MPVZ5004GW7U MPVZ5004G6U/T1 MPVZ5004G7U Freescale Semiconductor pressure sensor is designed to operate with positive differential pressure applied, P1 > P2. The Pressure (P1) side may be identified by using the table below. Pressure (P1) Side Identifier Vertical Port Attached Vertical Port Attached Stainless Steel Cap Stainless Steel Cap Case Type 1735-01 1560-02 482-01 482B-03 INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482) MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.660 16.76 0.100 TYP 8X 2.54 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 6. SOP Footprint (Case 482) MPVZ5004G 4 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ5004G Sensors Freescale Semiconductor 5 PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ5004G 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1735-01 ISSUE A SMALL OUTLINE PACKAGE MPVZ5004G Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ5004G 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ5004G Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1560-02 ISSUE C SMALL OUTLINE PACKAGE MPVZ5004G 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A4 5 D 8 PL 0.25 (0.010) M TB S A S -BG 8 1 NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 10.29 10.54 18.01 18.41 S N C H -TPIN 1 IDENTIFIER SEATING PLANE J K M DIM A B C D G H J K M N S CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -A4 5 -BG 8 1 0.25 (0.010) S N M TB D 8 PL S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. 6. DIMENSION S TO CENTER OF LEAD WHEN FORMED PARALLEL. DIM A B C D G J K M N S INCHES MILLIMETERS MIN MAX MIN MAX 0.415 0.425 10.54 10.79 0.415 0.425 10.54 10.79 0.210 0.220 5.33 5.59 0.026 0.034 0.66 0.864 0.100 BSC 2.54 BSC 0.009 0.011 0.23 0.28 0.100 0.120 2.54 3.05 0 15 0 15 0.405 0.415 10.29 10.54 0.540 0.560 13.72 14.22 DETAIL X PIN 1 IDENTIFIER C -TK M J DETAIL X SEATING PLANE CASE 482B-03 ISSUE B SMALL OUTLINE PACKAGE MPVZ5004G Sensors Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com E-mail: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 support@freescale.com Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) support@freescale.com Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 support.japan@freescale.com Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 support.asia@freescale.com For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. Box 5405 Denver, Colorado 80217 1-800-441-2447 or 303-675-2140 Fax: 303-675-2150 LDCForFreescaleSemiconductor@hibbertgroup.com Information in this document is provided solely to enable system and software implementers to use Freescale Semiconductor products. There are no express or implied copyright licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document. Freescale Semiconductor reserves the right to make changes without further notice to any products herein. Freescale Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. "Typical" parameters that may be provided in Freescale Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals", must be validated for each customer application by customer's technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer purchase or use Freescale Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold Freescale Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that Freescale Semiconductor was negligent regarding the design or manufacture of the part. FreescaleTM and the Freescale logo are trademarks of Freescale Semiconductor, Inc. All other product or service names are the property of their respective owners. (c) Freescale Semiconductor, Inc. 2006. All rights reserved. MPVZ5004G Rev. 1 01/2006 |
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